Thick tellurium electrodeposition on nickel-coated copper substrate for 124I production

Applied Radiation and Isotopes

Volumn 66, Issue 10, 2008, Pages 1281-1286

  Sadeghi, M ^a,b   Dastan, M ^b   Ensaf, M R ^a   Tehrani, A Abaspour ^b   Tenreiro, C ^c   Avila, M ^d  

^a AGRICULTURAL MEDICAL AND INDUSTRIAL RESEARCH SCHOOL   (Iran)

^b ISLAMIC AZAD UNIVERSITY   (Iran)

^c UNIVERSIDAD DE TALCA   (Chile)

^d Chilean Nuclear Energy Commission   (Chile)

Author keywords

124I; Production; Tellurium target; TeO2; Thick electrodeposition

Indexed keywords

COPPER; ELECTROPLATING; IODINE; METALLIZING; NICKEL; NICKEL ALLOYS; NONMETALS; PLATING; TELLURIUM;

124I; COPPER SUBSTRATES; OPTIMUM CONDITIONS; PLATING BATHS; PRODUCTION; TELLURIUM TARGET; TEO2; THICK ELECTRODEPOSITION;

ELECTRODEPOSITION;

COPPER; IODINE 124; NICKEL; TELLURIUM;

ARTICLE; DIRECT CURRENT; MATERIAL COATING; PH; PRIORITY JOURNAL; SCANNING ELECTRON MICROSCOPY; TEMPERATURE SENSITIVITY; THICKNESS;

COPPER; ELECTROPLATING; IODINE RADIOISOTOPES; NICKEL; RADIOPHARMACEUTICALS; SURFACE PROPERTIES; TELLURIUM;

EID: 48849104003     PISSN: 09698043     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apradiso.2008.02.082     Document Type: Article

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