Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2007, Pages 96-99

  Bernassau, A L ^a   McKay, S ^b   Hutson, D ^a   Demore C E M ^a   Garcia Gancedo, L ^c   Button, T W ^c   McAneny, J J ^b   Cochran, S ^a  

^a UNIVERSITY OF DUNDEE   (United Kingdom)

^b Logitech Ltd   (United Kingdom)

^c UNIVERSITY OF BIRMINGHAM   (United Kingdom)

Author keywords

1 3 piezocomposite; High frequency array; Lapping; Microfabrication; Photolithography; Polishing

Indexed keywords

LAPPING; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; PIEZOELECTRIC MATERIALS; POLISHING; ULTRASONIC IMAGING; ULTRASONICS;

1-3 PIEZOCOMPOSITE; ARRAY ELECTRODES; ARRAY ELEMENTS; ELECTRICAL CONTACTS; ELECTRODE EDGES; HIGH FREQUENCY ARRAY; HIGH FREQUENCY TRANSDUCERS; LINEAR ARRAYS; LOW FREQUENCIES; LOW TEMPERATURES; MECHANICAL LAPPING; PHOTOLITHOGRAPHIC PATTERNING; PHOTOLITHOGRAPHY PROCESSES; PIEZOCOMPOSITE MATERIALS; POLISHED SURFACES; SMOOTH SURFACES; SURFACE FINISHING; SURFACE FLATNESSES; SURFACE PREPARATIONS; ULTRASOUND IMAGING;

SURFACES;

EID: 48149102858     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2007.37     Document Type: Conference Paper

References (6)

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