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Volumn , Issue , 2007, Pages 507-510
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Trench-isolated CMUT arrays with a supporting frame: Characterization and imaging results
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Author keywords
CMUT; Supporting frame; Through wafer trench isolated interconnect; Volumetric imaging
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Indexed keywords
2-D ARRAY;
ARRAY ELEMENTS;
CMUT;
COLLAPSE MODES;
CONDUCTIVE SILICON;
ELECTRICAL CONTACTS;
FLIP-CHIP-BONDING;
FRAME STRUCTURES;
IMMERSION TESTING;
MECHANICAL SUPPORTS;
OPERATING FREQUENCIES;
PULL-IN;
RECTANGULAR MEMBRANES;
SILICON-ON-INSULATOR WAFERS;
SUPPORTING FRAME;
THROUGH-WAFER TRENCH-ISOLATED INTERCONNECT;
VOLUMETRIC IMAGING;
WAFER FUSION;
ELECTRONICS INDUSTRY;
FLIP CHIP DEVICES;
INTEGRATED CIRCUITS;
NONMETALS;
OPTICAL DESIGN;
SILICON;
SILICON WAFERS;
ULTRASONIC TRANSDUCERS;
ULTRASONICS;
WAFER BONDING;
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EID: 48149099587
PISSN: 10510117
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ULTSYM.2007.134 Document Type: Conference Paper |
Times cited : (5)
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References (5)
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