메뉴 건너뛰기




Volumn , Issue , 2007, Pages 507-510

Trench-isolated CMUT arrays with a supporting frame: Characterization and imaging results

Author keywords

CMUT; Supporting frame; Through wafer trench isolated interconnect; Volumetric imaging

Indexed keywords

2-D ARRAY; ARRAY ELEMENTS; CMUT; COLLAPSE MODES; CONDUCTIVE SILICON; ELECTRICAL CONTACTS; FLIP-CHIP-BONDING; FRAME STRUCTURES; IMMERSION TESTING; MECHANICAL SUPPORTS; OPERATING FREQUENCIES; PULL-IN; RECTANGULAR MEMBRANES; SILICON-ON-INSULATOR WAFERS; SUPPORTING FRAME; THROUGH-WAFER TRENCH-ISOLATED INTERCONNECT; VOLUMETRIC IMAGING; WAFER FUSION;

EID: 48149099587     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2007.134     Document Type: Conference Paper
Times cited : (5)

References (5)
  • 5
    • 48149106350 scopus 로고    scopus 로고
    • I. O. Wygant, X. Zhuang, D. T. Yeh, O. Oralkan, A. S. Ergun, M. Karaman, and B. T. Khuri-Yakub, Integration of 2D CMUT Arrays with Front-End Electronics for Volumetric Ultrasound Imaging, accepted for publication by IEEE Trans. Ultrason., Ferroelectr., Freq. Control.
    • I. O. Wygant, X. Zhuang, D. T. Yeh, O. Oralkan, A. S. Ergun, M. Karaman, and B. T. Khuri-Yakub, "Integration of 2D CMUT Arrays with Front-End Electronics for Volumetric Ultrasound Imaging," accepted for publication by IEEE Trans. Ultrason., Ferroelectr., Freq. Control.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.