Low cost packages for MEMS oscillators

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2007, Pages 273-277

  Hsu, Wan Thai ^a  

^a Discera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC RESONATORS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; MEMS; MICROELECTROMECHANICAL DEVICES; NONMETALS; RESONATORS; SILICON; SILICON WAFERS; TECHNOLOGY; VACUUM;

ASSEMBLY PROCESSING; ELECTRONICS MANUFACTURING; LOW COSTS; MEMS RESONATORS; PACKAGE DESIGNS; PLASTIC PACKAGING; RELIABILITY TESTING; SILICON CHIPS; SILICON OSCILLATORS; SILICON RESONATORS; VACUUM PACKAGING; WAFER LEVELS; WAFER-LEVEL VACUUM PACKAGING;

ELECTRONICS PACKAGING;

EID: 48149092092     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2007.4417076     Document Type: Conference Paper

References (13)

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9. M. Lemkin et al., "A Micromachined Fully Differential Lateral. Accelerometer", Technical Digest, CICC '96, pp. 315-318, May 1996.
10. Gianchandani, Y.B et al, "A MEMS-first fabrication process for integrating CMOS circuits with poly-silicon micro-structures", Technical Digest, MEMS 98, 25-29 Jan. 1998, pp. 257-262.
11. A. E. Franke and R. T. Howe, "Post-CMOS integration of Germanium Microstructures" Technical Digest, 12th IEEE International Conference on MEMS, Orlando, Florida, U.S.A., January 17-21, 1999, pp. 630-637.
12. W. -T Hsu and Minfan Pai, "The New Heart Beat of Electronics - Silicon MEMS Oscillators", ECTC 2007, May 31, 2007, Reno, NV.
13. W.-T. Hsu, "Reliability of Silicon MEMS Resonator Oscillators", Technical Digest, IEEE Frequency Control Symposium 2006, Miami, FL, USA, Jun. 4-6, 2006.