Transient non-linear thermal FEM simulation of smart power switches and verification by measurements

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 110-114

  Košel, Vladimír ^a,b   Sleik, Roland ^a   Glavanovics, Michael ^a  

^a Kompetenzzentrum Automobil und Industrie Elektronik Gmbh   (Austria)

^b SLOVAK UNIVERSITY OF TECHNOLOGY   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALS; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTIVITY; MATERIALS SCIENCE; NONMETALS; POWER ELECTRONICS; SEMICONDUCTOR MATERIALS; SILICON; SWITCHES; THERMODYNAMIC PROPERTIES;

DURATION TIME; FEM SIMULATIONS; FINITE-ELEMENT METHODS; MATE RIAL PROPERTIES; MATERIAL MODELLING; NON-LINEAR; POWER DISSIPATIONS; POWER SEMI-CONDUCTOR; SIMULATION RESULTS; SMART POWER; SMART POWER DEVICES; TEMPERATURE PROTECTION; TEMPERATURE REFERENCE; TEMPERATURE-DEPENDENT; THERMAL PROPERTIES;

FINITE ELEMENT METHOD;

EID: 48049103034     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451757     Document Type: Conference Paper

References (13)

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