An efficient method for power integrity and EMI analysis of irregular-shaped power/ground planes in packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 263-266

  Liu, En Xiao ^a   Wei, Xingchang ^a   Oo, Zaw Zaw ^a,b   Li, Er Ping ^a,b  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL EQUATIONS; ELECTRONICS PACKAGING; GREEN'S FUNCTION;

2D SIMULATIONS; EFFICIENT METHODS; ELECTRONIC PACKAGES; EMI ANALYSES; EXPERIMENTAL VALIDATIONS; FULL WAVE METHODS; MAGNETIC SOURCES; POWER INTEGRITIES;

ELECTROMAGNETIC PULSE;

EID: 47949120855     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387177     Document Type: Conference Paper

References (8)

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