PPW noise mitigation in multilayer PCBs by means of Virtual Island and/or array of shorting vias

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2007, Pages

  Scogna, A Ciccomancini ^a  

^a CELL SIGNALING TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INVERTERS; ELECTROMAGNETISM; LANDFORMS; PLASTIC MOLDS; POLYCHLORINATED BIPHENYLS; RELIABILITY; SIGNAL PROCESSING; TECHNICAL PRESENTATIONS;

BOTTOM LAYERS; FREQUENCY DOMAINS; INSERTION LOSSES; INTERNATIONAL SYMPOSIUM; MICRO-STRIP LINES; MULTI LAYERING; NOISE MITIGATION; NOISE-SUPPRESSION; PARALLEL-PLATE WAVEGUIDES; SIGNAL-INTEGRITY; SINGLE-ENDED; TIME DOMAIN OCT;

ELECTROMAGNETIC COMPATIBILITY;

EID: 47749145767     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2007.164     Document Type: Conference Paper

References (10)

1. S. Nam, Y. Kim, H. Jang, J. Jeong at Al., "Performance analysis of signal vias using Virtual Island with shorting vias in multilayer PCBs", in IEEE Trans. on Microwave Theory and Technique, April 2005.
2. C. Schuster and W. Fichtner, "Parasitic modes on printed circuit boards and their effects on EMC and signal integrity", IEEE Trans. Electromagnetic Compaibility, vol. 43, no. 11, pp. 416-425, Nov. 2001.
3. W.Cui, X. Ye, B.Archambeault, J.L.Drewniak, M. Li, D. White, "EMI resulting from signal via transition through the DC power bus", in Proc. of IEEE Int. Symp. on Electromagn Compat., Whashington D.C., USA, August 2000, pag. 821-826.
4. J. Mao, B. Archambeault, J. L. Drewniak, T. P. Van Doren, "Estimating DC Power Bus Noise", in Proc. of IEEE Int. Symp. on EMC, Minneapolis, MN, USA, August 19-23, 2002.
5. J. Fan, W. Cui, J.L.Drewniak, T. Van Doren, J. L. Knighten, "Estimating the Noise Mitigation Effect of Local Decoupling in Printed Circuit Boards", in IEEE Trans. on Advanced Packaging, vol.25, n.2, May 2000, pag. 154-165.
6. G. Chen, K. L. Medle, "Cavity Resonance Suppression in Power Delivery Systems Using Electromagnetic Band Gap Structures", in IEEE Trans. on Advanced Packaging, vol.29, n.1, February 2006, pag. 21-30.
7. CST Studio Suite 2006B, www.cst.com
8. J.Fang, J.Zhao, J. Zhang, "Shorting Via Arrays for the Elimination of Package Resonance to Reduce Power Supply Noise in Multi-layered Area-Array IC Packages", in Proc. of IEEE Int. Symp. On EMC, Feb.1998, pag.116-119.
9. T. Liu, Y. H. Lin, S. T. Chen, "A novel power plane with low radiation and broadband suppression of power ground noise using photonic band gap structure", in IEEE Microwave and Wireless Comp. and Letters, vol. 14, n.7, July 2004.
10. Y.H Lin, T.L. Wu, "Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurements", in Proc. of IEEE Int. Symp. Electromagnetic Compatibility, Montreal, QC, Canada, August 2002, pag.319-324.