Power and ground bounce effects on component performance based on printed circuit board edge termination methodologies

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2007, Pages

  Montrose, Mark I ^a   Liu, En Xiao ^b  

^a Montrose Compliance Services Inc   (United States)

^b INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

20 H rule; Board edge radiated emissions; Ground bounce; Power bounce; Printed circuit board (PCB); RC plane termination; SI; SSN

Indexed keywords

20-H RULE; BOARD EDGE RADIATED EMISSIONS; GROUND BOUNCE; POWER BOUNCE; RC PLANE TERMINATION; SI; SSN;

DISTRIBUTED PARAMETER NETWORKS; DISTRIBUTION OF GOODS; ELECTRIC INVERTERS; ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER DISTRIBUTION; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; LOUDSPEAKERS; NETWORKS (CIRCUITS); PLASTIC MOLDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SANITARY SEWERS; SIGNAL PROCESSING;

PRINTED CIRCUIT BOARDS;

EID: 47749105705     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2007.114     Document Type: Conference Paper

References (5)

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3. Gisin F., and Pantic-Tanner, Z. "Radiation from Printed Circuit Board Edge Structures." 2001. IEEE International Symposium on EMC, pp. 881-883.
4. S. Van den Berghe, F. Olyslager, D. de Zutter, J. de Moerloose, and W. Temmerman, "Study of the ground bounce caused by power plane resonances," IEEE Transactions on EMC, V40(2), pp. 111-119, May 1998.
5. Lei, G., R. W. Techentin, and B. K. Gilbert. "HighFrequency Characterization of Power/Ground Structures," IEEE Transactions on Microwave Theory Techniques, vol. 47, pp. 562-569, May 1999.