Computerized system for assessment of quality of solders

The Experience of Designing and Application of CAD Systems in Microelectronics - Proceedings of the 7th International Conference, CADSM 2003

Volumn , Issue , 2003, Pages 56-58

  Sankowski, Dominik ^a   Senkara, Jacek ^b   Strzecha, Krzysztof ^a  

^a LODZ UNIVERSITY OF TECHNOLOGY   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Computerized measurements; Elevated temperature measurements; Solderability tests; Solders

Indexed keywords

MICROELECTRONICS; SOLDERING; TEMPERATURE MEASUREMENT;

COMPUTERIZED SYSTEMS; SOLDERABILITY TESTS;

COMPUTER AIDED DESIGN;

EID: 47749091140     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CADSM.2003.1254981     Document Type: Conference Paper

References (6)

1. M.G. Nicholas: Joining of Ceramics. Chapman&Hall, 1990.
2. F.G. Yost, F.M. Hosking, D.R. Frear: The Mechanics of Solder Alloy Wetting and Spreading. Van Nostrand Reinhold, NY, 1993.
3. N. Eustathopoulos, M.G. Nicholas, B. Drevet: Wettability at High Temperatures. Pergamon, 1999.
4. M. Miyazaki, M. Mizutani, T. Takemoto, A. Maisunawa: Conditions for the Measurement of Surface tension of Solders with a Wetting Balance Tester. Trans. JWRI, 26(1997)81-84.
5. ISO/DIS 9455-10: Flux Efficiency Test Solder Spread Method.
6. D. Sankowski, J. Senkara, K. Strzecha, S. Jezewski: Automatic investigation of surface phenomena in high temperature solid and liquid contacts. 18th IEEE Instrumentation and - Measurement Technology Conference, Budapest, Hungary 2001, 346-249.