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Volumn , Issue , 2006, Pages

Impact of nanotechnology on wireless communications

Author keywords

Multilayer package analysis; Nanotechnology; Wireless communication

Indexed keywords

ANTENNA ACCESSORIES; ANTENNAS; CELLULAR TELEPHONE SYSTEMS; COMMUNICATION; COMMUNICATION SYSTEMS; CRACK PROPAGATION; DATA TRANSFER; DATA TRANSFER RATES; ELECTROMAGNETIC COMPATIBILITY; ENERGY STORAGE; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; INTEGRATED CIRCUITS; MICROWAVE ANTENNAS; MICROWAVES; MOBILE COMPUTING; MOBILE DEVICES; NANOTECHNOLOGY; PLASTIC MOLDS; SOLUTIONS; TECHNICAL PRESENTATIONS; TECHNOLOGICAL FORECASTING; TECHNOLOGY; TECHNOLOGY TRANSFER; TELECOMMUNICATION; TELECOMMUNICATION EQUIPMENT; TELECOMMUNICATION SYSTEMS;

EID: 47649101283     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MAPE.2007.4393805     Document Type: Conference Paper
Times cited : (5)

References (8)
  • 1
    • 47649112954 scopus 로고    scopus 로고
    • RF and analogy/mixed-signal technologies for wireless communications, International, 2005 Edition
    • RF and analogy/mixed-signal technologies for wireless communications, International Technology Raadmap for Semiconductors, 2005 Edition, /www.itrs.net/.
    • Technology Raadmap for Semiconductors
  • 3
    • 3042751612 scopus 로고    scopus 로고
    • Gigabit Wireless: System-on-package Technology
    • Vo
    • R. Tummala and J. Laskar, "Gigabit Wireless: System-on-package Technology," Proceedings of IEEE, Vo.92, no.2, 2004.
    • (2004) Proceedings of IEEE , vol.92 , Issue.2
    • Tummala, R.1    Laskar, J.2
  • 4
    • 10644249590 scopus 로고    scopus 로고
    • Device technologies for RF front-end circuits in next generation wireless communications
    • M. Feng, S. C. Shen, D. Caruth and J. J. Huang, "Device technologies for RF front-end circuits in next generation wireless communications," Proceedings of the IEEE, vol.92, 2004.
    • (2004) Proceedings of the IEEE , vol.92
    • Feng, M.1    Shen, S.C.2    Caruth, D.3    Huang, J.J.4
  • 6
  • 8
    • 33947241371 scopus 로고    scopus 로고
    • Sensitivity of coupled interconnects for RFIC applications
    • Nov
    • X. Shi, K. S. Yeo, J-G Ma and E.P.LI, " Sensitivity of coupled interconnects for RFIC applications", IEEE Transactions on EMC, vol.48, no.4, pp. 607-613, Nov. 2006
    • (2006) IEEE Transactions on EMC , vol.48 , Issue.4 , pp. 607-613
    • Shi, X.1    Yeo, K.S.2    Ma, J.-G.3    LI, E.P.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.