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Volumn 44, Issue 6, 2008, Pages 61-65

Delamination behavior and formation mechanism of the interfacial microstructure in the brazed joint of silver-copper-titanium alloy and cubic boron nitride grain

Author keywords

Atom diffusion; Cubic boron nitride grain; Microstructure delamination; Silver copper titanium alloy; Thermodynamic analysis

Indexed keywords

ABRASIVES; ATOMS; BRAZING; CUBIC BORON NITRIDE; FILLERS; III-V SEMICONDUCTORS; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SPECTROMETERS; SUBSTITUTION REACTIONS; TERNARY ALLOYS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES; TITANIUM ALLOYS; TITANIUM NITRIDE;

EID: 47549116267     PISSN: 05776686     EISSN: None     Source Type: Journal    
DOI: 10.3901/jme.2008.06.061     Document Type: Article
Times cited : (6)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.