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Volumn 44, Issue 6, 2008, Pages 61-65
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Delamination behavior and formation mechanism of the interfacial microstructure in the brazed joint of silver-copper-titanium alloy and cubic boron nitride grain
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Author keywords
Atom diffusion; Cubic boron nitride grain; Microstructure delamination; Silver copper titanium alloy; Thermodynamic analysis
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Indexed keywords
ABRASIVES;
ATOMS;
BRAZING;
CUBIC BORON NITRIDE;
FILLERS;
III-V SEMICONDUCTORS;
JOINTS (STRUCTURAL COMPONENTS);
MICROSTRUCTURE;
SCANNING ELECTRON MICROSCOPY;
SILVER ALLOYS;
SPECTROMETERS;
SUBSTITUTION REACTIONS;
TERNARY ALLOYS;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
TITANIUM ALLOYS;
TITANIUM NITRIDE;
ATOM DIFFUSION;
CUBIC BORON NITRIDE (CBN);
DISPLACEMENT REACTIONS;
ENERGY DISPERSION SPECTROMETERS;
INTERFACIAL COMPOUNDS;
INTERFACIAL MICROSTRUCTURE;
SILVER COPPER TITANIUM ALLOYS;
THERMO DYNAMIC ANALYSIS;
COPPER ALLOYS;
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EID: 47549116267
PISSN: 05776686
EISSN: None
Source Type: Journal
DOI: 10.3901/jme.2008.06.061 Document Type: Article |
Times cited : (6)
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References (14)
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