Some problems in switching to lead-free solders

Soldering and Surface Mount Technology

Volumn 9, Issue 1, 1997, Pages 12-15

  Hampshire, W B ^a  

^a Hampshire Technical Services   (United States)

Author keywords

Load Free Soldering; Soldering

Indexed keywords

AUTOMOBILES; COST ACCOUNTING; CUSTOMER SATISFACTION; ENVIRONMENTAL IMPACT; IGNITION; PRODUCTION; RECYCLING; SWITCHING;

DYING BATTERY; ELECTRONIC SOLDERS; LOAD-FREE SOLDERING; STICKER SHOCK;

SOLDERING ALLOYS;

EID: 4744374152     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (4)

1. Proceedings of Surface Mount International. 1992, SMTA, "'White Paper: Assessment of the Use of Lead in Electronic Assembly'", 1, "'The Search for Lead-Free Solders", W.B.Hampshire, 729, Nepcon Proceedings, SMI Proceedings, AIME Conference Proceedings, Northwestern University. 1995.
2. "'Development of Improved Solders for Electronic Reliability", Hughes Aircraft Company, Fullerton, CA, AFML-TR-77-93, Ohio, 1977.
3. Private communication from ITRI, Ltd, Uxbridge, England.
4. Heiser, E.A., Moy, P.C., Munie, G.G., Machusak, P.A., Wenger, G.M., "'Development of AT & T's Internal Solderability Standard: Building on External Specifications and Assembly Experience", Proceedings Surface Mount International 1995, San Jose, California, 468, 1995.