Microstructural investigation of Sn-Ag and Sn-Ag solder joints

Soldering and Surface Mount Technology

Volumn 9, Issue 2, 1997, Pages 10-19

  Chada, S ^a   Herrmann, A ^a   Laub, W ^a   Fournelle, R ^a   Shangguan, D ^b   Achari, A ^b  

^a MARQUETTE UNIVERSITY   (United States)

^b FORD MOTOR COMPANY   (United States)

Author keywords

Solder; Solder Joint

Indexed keywords

ANNEALING; COOLING; COPPER; EUTECTICS; FATIGUE OF MATERIALS; LEAD; MICROHARDNESS; MICROSTRUCTURE; SILVER; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

COARSENING BEHAVIOR; COOLING RATE; ISOTHERMAL ANNEALING; MICROSTRUCTURAL EVOLUTION;

SOLDERED JOINTS;

EID: 4744361733     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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