Reliable 3D damascene MIM architecture embedded into Cu interconnect for a Ta2O5 capacitor record density of 17 fF/μm2

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 2007, Pages 58-59

  Thomas, M ^a,b   Farcy, A ^a   Perrot, C ^a   Deloffre, E ^a   Gros Jean, M ^a   Benoit, D ^a   Richard, C ^a   Caubet, P ^a   Guillaumet, S ^a   Pantel, R ^a   Cordeau, M ^c   Piquet, J ^d   Bermond, C ^d   Flechet B ^d   Chenevier, B ^b   Torres, J ^a  

^a STMICROELECTRONICS   (France)

^b LABORATOIRE DES MATÉRIAUX ET DU GÉNIE PHYSIQUE   (France)

^c CEA LETI   (France)

^d UNIVERSITÉ DE SAVOIE   (France)

Author keywords

Cu interconnect; Damascene architecture; MIM capacitor; RF and analog applications

Indexed keywords

COPPER; ENERGY STORAGE; OPTICAL INTERCONNECTS; TANTALUM;

CU INTERCONNECTS; HIGH-DENSITY; META INSULATOR METAL (MIM) CAPACITORS; VLSI TECHNOLOGIES;

MIM DEVICES;

EID: 47249157627     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VLSIT.2007.4339726     Document Type: Conference Paper

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