Numerical analysis of edge effects in adhesively-bonded assemblies application to the determination of the adhesive behaviour

Computers and Structures

Volumn 86, Issue 17-18, 2008, Pages 1704-1717

  Cognard, Jean Yves ^a  

^a ENSIETA   (France)

Author keywords

Adhesive testing; Edge effects; Finite element simulations; Joint design; Non linear behaviour; Stress analysis

Indexed keywords

ADHESIVE JOINTS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GEOMETRY; MARINE APPLICATIONS; MODAL ANALYSIS; PARAMETER ESTIMATION; PHOTOACOUSTIC EFFECT; STRESSES;

BONDED JOINTS; EDGE EFFECTS; ELASTIC BEHAVIOUR; ELSEVIER (CO); EXPERIMENTAL TESTING; FINITE ELEMENT ANALYSIS (FEA); FREE EDGES; IN ORDER; LOCAL GEOMETRY; MECHANICAL BEHAVIOURS; NONLINEAR BEHAVIOURS; NUMERICA L RESULTS; NUMERICAL MODELLING; NUMERICAL SIMULATIONS; STRESS SINGULARITIES; UNDERWATER APPLICATIONS;

NUMERICAL ANALYSIS;

EID: 47049129910     PISSN: 00457949     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compstruc.2008.02.003     Document Type: Article

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