Dynamic crack extension along the interface of materials that differ in thermal properties: Convection and thermal relaxation

Journal of Applied Mechanics, Transactions ASME

Volumn 75, Issue 2, 2008, Pages 0210181-0210187

  Brock, L M ^a  

^a UNIVERSITY OF KENTUCKY   (United States)

Author keywords

Biot number; Convection; Dynamic interface crack; Fourier heat conduction; Singular integral equations; Thermal mismatch; Thermal relaxation

Indexed keywords

BI MATERIALS; BONDED MATERIALS; CRACK EXTENSIONS; CRACK SURFACES; FOURIER HEAT CONDUCTION; HIGH SPEEDS; MATERIAL MISMATCH; MOVING SURFACES; PLANE STRAINS; SOLUTION BEHAVIOR; STEADY STATES; TWO RELAXATION TIMES;

HEAT CONDUCTION; SPEED; THERMODYNAMIC PROPERTIES;

MATERIALS PROPERTIES;

EID: 47049116665     PISSN: 00218936     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2793802     Document Type: Article

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