An EMI simulator based on the parallel-distributed FDTD method for large-scale printed wiring boards

Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

Volumn , Issue , 2002, Pages 141-144

  Asai, Hideki ^a   Watanabe, Takayuki ^b   Sasaki, Tohru ^c   Araki, Kenji ^d  

^a SHIZUOKA UNIVERSITY   (Japan)

^b UNIVERSITY OF SHIZUOKA   (Japan)

^c A Priori Microsystems Inc   (Japan)

^d Sony Corporation Semiconductor Network Company   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; CRACK PROPAGATION; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; FINITE DIFFERENCE METHOD; FINITE DIFFERENCE TIME DOMAIN METHOD; INTERCHANGES; PRINTED CIRCUIT BOARDS; QUALITY ASSURANCE; RELIABILITY; SIGNAL PROCESSING; WAVES;

DESIGN FLOWS; ELECTRO-MAGNETIC INTERFERENCE (EMI); ELECTROMAGNETIC COMPATIBILITY (EMC); FDTD METHODS; FINITE DIFFERENCE (FD); FULL-WAVE ANALYSIS (FWA); PC CLUSTERING; PRINTED WIRING BOARD (PWB); REASONABLE TIME; SIGNAL PROPAGATION; SIGNAL-INTEGRITY (SI);

SIMULATORS;

EID: 46649111318     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2002.258300     Document Type: Conference Paper

References (8)

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