Plastic deformation in silicon crystal induced by heat-assisted laser shock peening

Journal of Manufacturing Science and Engineering

Volumn 130, Issue 1, 2008, Pages 0110081-0110085

  Cheng, Gary J ^a   Cai, M ^b   Pirzada, Daniel ^c   Guinel, Maxime J F ^c   Norton, M Grant ^c  

^a SCHOOL OF INDUSTRIAL ENGINEERING   (United States)

^b UNIVERSITY OF HOUSTON   (United States)

^c Washington State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; CRYSTALS; FRACTURE TOUGHNESS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; PLASTIC DEFORMATION; RESIDUAL STRESSES; SILICON;

APPLICATION OF LASER; COMPRESSIVE RESIDUAL STRESS; DISLOCATION ACTIVITY; DISLOCATION STRUCTURES; ELECTRON BACK-SCATTERED DIFFRACTION; LASER SHOCK PEENING; SHOCK COMPRESSIONS; SILICON CRYSTAL;

LASER MATERIALS PROCESSING;

EID: 46649107519     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2815343     Document Type: Article

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