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Volumn 277, Issue 1, 2008, Pages 103-110

Use of electrodeposition for sample preparation and rejection rate prediction for assay of electroformed ultra high purity copper for 232Th and 238U prior to inductively coupled plasma mass spectrometry (ICP/MS)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; THORIUM 232; URANIUM 238;

EID: 46449134068     PISSN: 02365731     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10967-008-0716-5     Document Type: Article
Times cited : (27)

References (4)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.