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Volumn 277, Issue 1, 2008, Pages 103-110
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Use of electrodeposition for sample preparation and rejection rate prediction for assay of electroformed ultra high purity copper for 232Th and 238U prior to inductively coupled plasma mass spectrometry (ICP/MS)
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
THORIUM 232;
URANIUM 238;
ARTICLE;
CHEMICAL ANALYSIS;
CHEMICAL REACTION;
ELECTRODE;
MASS SPECTROMETRY;
RADIOASSAY;
WAVEFORM;
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EID: 46449134068
PISSN: 02365731
EISSN: None
Source Type: Journal
DOI: 10.1007/s10967-008-0716-5 Document Type: Article |
Times cited : (27)
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References (4)
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