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Volumn , Issue , 2006, Pages 206-210
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Effects of flux residues on surface insulation resistance and electrochemical migration
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Author keywords
[No Author keywords available]
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Indexed keywords
BRAZING;
CHEMICAL ENGINEERING;
CHEMICAL REACTIONS;
CLEANING;
DATA ACQUISITION;
ELECTRIC DISCHARGE MACHINING;
ELECTRIC NETWORK ANALYSIS;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONICS PACKAGING;
EXPERIMENTS;
HEALTH;
IONIZATION OF LIQUIDS;
LAUNCHING;
PHOTOACOUSTIC EFFECT;
PRINTED CIRCUIT BOARDS;
SOLDERING;
SPRINGS (COMPONENTS);
SURFACE CLEANING;
SURFACE RESISTANCE;
SURFACES;
TECHNOLOGY;
TECHNOLOGY TRANSFER;
TESTING;
WELDING;
(1 1 0) SURFACE;
ACQUISITION DEVICES;
APPLIED (CO);
CLEANING PROCESSES;
CONFERENCE PROCEEDINGS;
DIFFERENT TYPES;
ELECTRICAL CIRCUITS;
ELECTROCHEMICAL MIGRATION (ECM);
ELECTRONICS TECHNOLOGY;
FAILURE MECHANISMS;
FAILURE RATES;
FINE PITCH;
FLUX RESIDUES;
IN ORDER;
INORGANIC MATERIALS;
INTERNATIONAL (CO);
MEAN TIME-TO-FAILURE (MTTF);
MIGRATION PROCESSES;
NANO TECHNOLOGIES;
PHYSICAL-CHEMICAL PROCESSES;
PRINTED WIRING BOARDS (PWB);
REPRODUCIBILITY;
SURFACE INSULATION RESISTANCE (SIR);
TEST RESULTS;
WATER DROPS;
WAVE SOLDERING;
FLUXES;
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EID: 46449129477
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISSE.2006.365387 Document Type: Conference Paper |
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Times cited : (24)
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References (6)
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