SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 468, Issue 1-2, 2004, Pages 113-119

Substrate melting during thermal spray splat quenching

(6) Li, L a Wang, X Y a Wei, G b Vaidya, A a Zhang, H b Sampath, S a

a STONY BROOK UNIVERSITY (United States)

b Stony Brook University (United States)

Author keywords

Bonding; Crater; Heat conduction; Plasma spray

Indexed keywords

ADHESION; APPROXIMATION THEORY; BONDING; HEAT CONDUCTION; HEAT TRANSFER; MATHEMATICAL MODELS; NUCLEATION; NUMERICAL METHODS; QUENCHING; SOLIDIFICATION; SUBSTRATES;

ADHESION STRENGTH; CRATER; MICROCASTING; SOLID-LIQUID INTERFACES; THERMAL SPRAYING;

PLASMA SPRAYING;

EID: 4644297733 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2004.05.073 Document Type: Article

Times cited : (94)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.