Low temperature curing of polyimide wafer coatings

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 149-151

  Hubbard, R L ^a   Fathi, Z ^a   Ahmad, I ^a   Matsutani, H ^b   Hattori, T ^b   Ohe, M ^c   Ueno, T ^c   Schuckert, C E ^c  

^a Lambda Technologies   (United States)

^b Resonac Corporation   (Japan)

^c HD Microsystems ^*

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); IMIDIZATION; MICROWAVE SUSCEPTIBILITY; VARIABLE FREQUENCY MICROWAVE (VFM);

CERAMIC MATERIALS; COATINGS; CURING; MICROWAVES; MOLECULAR STRUCTURE; POLYIMIDES; POLYMERIZATION; SILICON WAFERS; THERMAL EXPANSION;

PLASTIC FILMS;

EID: 4644297448     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Kohl, P.A. et al, IEEE Transactions (CPMT), Vol 24, No.3 (2001), pp.474-481.
2. Garrard, R. et al, "Curing Low Yields & Reliability issues in Photonics Assembly", Proc. Of the Pan Pacific Microelectronics Symposium, Maui, Hawaii, February 2002.