Soft gold electroplating from a non-cyanide bath for electronic applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 242-246

  Wang, Kai ^a   Beica, Rozalia ^a   Brown, Neu ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODE EFFICIENCY; DEPOSIT MORPHOLOGY; SOLDERABILITY;

BOND STRENGTH (MATERIALS); CURRENT DENSITY; ELECTROPLATING; GOLD; HARDNESS; PHOTORESISTS; SODIUM; TOXICITY; WETTING;

MICROELECTRONICS;

EID: 4644256890     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Okinaka, Y. and Hoshino, M. "Some Recent Topics in Gold Plating for Electronics Applications", Gold Bulletin, Vol. 31, No. 1 (1998), pp. 3-13.
2. th Edition, John Wiley & Sons (2000), pp. 201-225.
3. Latimer, W. M., Oxidation Potentials Prentice hall, Inc., (1952), p. 195.
4. Honma, H. and Hagiwara, K., "Fabrication of Gold Bumps Using Gold Sulfite Plating", J. Electrochem. Society, Vol. 42, No. 1, pp. 81-87.
5. Osaka, T., Kodera, A., Misato, T., Homma, T., Okinaka, O. and Yoshioka, O., "Electrodeposition of Soft Gold from a Thiosulfate-Sulfite Bath for Electronics Applications", J. Electrochem. Soc., Vol. 144, No. 10 (1997), pp. 3462-3469.
6. Kato, M., Niikura, K., Hoshino, S. and Ohono, I., "Electrochemical Behavior of electroless Gold Plating with Ascorbic Acid as a Reducing Agent", J. Surf. Finish. Soc. Jpn., Vol. 42, No. 7, pp. 729-735.
7. Rapson, W. S. and Groenewald, T., Gold Usage Academic Press, Inc. (1978).
8. Morrissey, R. J., "A Versatile Non-cyanide Gold Plating System", Plating and Surface Finishing, Vol. 80, No. 4 (1993), pp. 75-79.
9. Honma H. and Kagaya, Y., "Gold Plating Using the Disulfiteaurate Complex", J. Electrochem. Soc., Vol. 140, No. 9 (1993), pp. L135-L137.
10. Pouradier, J. and Gadet, M. C., J. Chim. Phys., Vol. 66, (1964), p. 109.
11. Reid, F. H. and Goldie, W., Gold Plating Technology Electrochemical Publications, Ltd. (1974).
12. th IEEE Electronic Components Technology Conference, 1995, pp. 1059-1067.
13. Kato, M., Yazawa, Y. and Okinaka, Y., "Electroless Gold Plating Bath Using Ascorbic Acid as Reducing Agent-Recent Improvements", Proceedings of AESF Technical Conf. SUR/FIN '95 (1995), pp. 805-813.
14. Sullivan, A. M. and Kohl, P. A., "Electrochemical Study of the Gold Thiosulfete Reduction", J. Electrochem. Soc., Vol. 144, No. 5 (1997), pp. 1686-1690.
15. Erickson, D., Internal Report, Semitool, Inc., April 2004.