Analysis of power and ground islands in printed circuit boards

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2004, Pages 39-44

  Costa, Viscardo ^a   Politi, Marco ^b   Gualdoni, Marcello ^b  

^a Italtel SpA   (Italy)

^b POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC VARIABLES CONTROL; ACOUSTIC WAVE PROPAGATION; COMPUTER SIMULATION; COPPER; DIELECTRIC MATERIALS; ELECTRIC CURRENTS; ELECTRIC GROUNDING; ELECTRIC POTENTIAL; MATHEMATICAL MODELS; NATURAL FREQUENCIES; SIGNAL INTERFERENCE;

CIRCUIT MODELS; COAXIAL CONNECTORS; COMMERCIAL FIELD SOLVERS; GROUND ISLANDS;

PRINTED CIRCUIT BOARDS;

EID: 4644229287     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. J. Fan, et all, "RF isolation using power islands in DC power bus design", 1999 International Symposium on EMC, Seattle (WA), pp. 838-843, August 1999
2. L. D. Smith, R. Anderson, T. Roy, "Power plane Spice models and simulated performance for materials and geometries", IEEE Trans. On Advanced Packaging, vol. 24, no. 3, pp. 277-287, August 2001
3. S. Van den Berghe, et all, "Power plane resonances as a source of delta-I noise and the influence of decoupling capacitors", University of Gent, pp. 145-148 Gent, 1997
4. S. Van den Berghe, et all, "Study of the ground bounce caused by power plane resonances", IEEE Trans. On EMC, vol. 40, no. 2, pp. 111-119, May 1998
5. H. H. Wu, J. W. Meyer, K. Lee, A. Barber, "Accurate power supply and ground plane pair models", IEEE Trans. On Advanced Packaging, vol. 22, no. 3, pp. 259-266, August 1999
6. J. H. Kim, M. Swaminathan, "Modeling of irregular shaped power distribution using transmission matrix method", IEEE Trans. On Advanced Packaging, vol. 24, no. 3, pp. 334-346, August 2001.
7. S. Ramo, J. R. Whinnery, T. van Duzer, "Fields and waves in communication electronics", Wiley, New York, 1984
8. J. H. Kim M. Swaminathan, "Modeling of irregular shaped power distribution plane using transmission matrix method", IEEE Trans. On Advanced Packaging, vol. 24, no. 3, pp. 334-346, August 2001
9. K. C. Gupta, R. Garg, I. J. Bahl, "Microstrip lines and slot lines", Artech House Inc., Dedham, Massachussets, U.S.A., 1979.
10. HFSS User's Manual
11. MWS User's Manual