Performance ranking of Asian lead frame firms: A slack-based method in data envelopment analysis

International Journal of Production Research

Volumn 46, Issue 14, 2008, Pages 3875-3885

  Chang, S Y ^a   Chen, T H ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b FAR EAST UNIVERSITY   (Taiwan)

Author keywords

Data envelopment analysis; Lead frame industry; Performance; Ranking; Slack

Indexed keywords

COMPETITION; DATA ENVELOPMENT ANALYSIS; INDUSTRIAL ECONOMICS; INNOVATION; LEAD; LINEAR PROGRAMMING; PHOTODISSOCIATION; SEMICONDUCTOR GROWTH;

APPLIED (CO); COMPETITIVE ADVANTAGES; COMPETITIVE ENVIRONMENTS; DATA ENVELOPMENT; DATA ENVELOPMENT ANALYSIS (DEA); HIGH-TECHNOLOGY; LEADFRAME (LF); LITERATURE REVIEWS; MANAGEMENT PERFORMANCE; OPERATING DATA; PERFORMANCE EVALUATION (PE); SEMICONDUCTOR FOUNDRIES; SLACK ANALYSIS;

INDUSTRY;

EID: 46149116129     PISSN: 00207543     EISSN: 1366588X     Source Type: Journal    
DOI: 10.1080/00207540701197044     Document Type: Article

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