Thermal-induced leakage power optimization by redundant resource allocation

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

Volumn , Issue , 2006, Pages 297-302

  Ni, Min ^a   Memik, Seda Ogrenci ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BEST SOLUTION; COMPUTER-AIDED DESIGN; DESIGN STAGES; GENERAL (CO); HOT-SPOTS; INTERNATIONAL CONFERENCES; LEAKAGE MODELS; LEAKAGE POWER; LEAKAGE POWER OPTIMIZATION; LOW LEAKAGE; LOW POWERS; LOW-POWER DESIGNS; ON CHIP TEMPERATURE; OPERATING CONDITIONS; OPTIMAL NUMBER; OPTIMAL RESOURCE; OPTIMAL VALUES; POWER DENSITY (PD); RESOURCE BINDING; RESOURCE USAGE; STARTING POINTS;

COMPUTER RESOURCE MANAGEMENT; DESIGN; ELECTRIC POWER SUPPLIES TO APPARATUS; MANAGEMENT; MOBILE TELECOMMUNICATION SYSTEMS; OPTIMIZATION; PLANNING; RESOURCE ALLOCATION;

LEAKAGE CURRENTS;

EID: 46149106383     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2006.320049     Document Type: Conference Paper

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