Simulation of drying process of suspensions containing fine solid particles using DEM and CIP method

Kagaku Kogaku Ronbunshu

Volumn 34, Issue 3, 2008, Pages 321-330

  Nishiura, Daisuke ^a   Shimosaka, Atsuko ^a   Shirakawa, Yoshiyuki ^a   Hidaka, Jusuke ^a  

^a DOSHISHA UNIVERSITY   (Japan)

Author keywords

Drying; Evaporation; Particles; Simulation; Suspension

Indexed keywords

CURING; DEWATERING; FLOW INTERACTIONS; FLOW OF FLUIDS; FLUID DYNAMICS; FLUID MECHANICS; LAW ENFORCEMENT; MULTIPHASE FLOW; SURFACE CHEMISTRY; SURFACE TENSION; SUSPENSIONS (COMPONENTS); SYSTEMS ENGINEERING; VAN DER WAALS FORCES;

BROWNIAN FORCES; CIP METHODS; CONSTRAINED INTERPOLATION PROFILE; CONTACT FORCES; CONTROL OF STRUCTURE; DISCRETE ELEMENT METHOD; DISPERSION CONDITIONS; DOUBLE ELECTRIC LAYERS; DRYING BEHAVIOR; DRYING PROCESSES; DRYING RATES; EVAPORATION; FINE PARTICLES; FINE SOLID PARTICLES; FLOATING PARTICLES; GAS LIQUIDS; INTERACTION FORCES; LIQUID SURFACES; MECHANICAL CONTACTS; PACKING STRUCTURES; PARTICLE ARRANGEMENTS; PARTICLE BEHAVIOR; PARTICLE LAYERS; PARTICLE PACKINGS; PARTICLES; SIMULATION; SIMULATION METHODS; SUSPENSION; TOP SURFACE; VAN DER WAALS;

DRYING;

EID: 45949097637     PISSN: 0386216X     EISSN: 13499203     Source Type: Journal    
DOI: 10.1252/kakoronbunshu.34.321     Document Type: Article

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