Microsystems elements based on free-standing thick-films made with a new sacrificial layer process

Microelectronics Reliability

Volumn 48, Issue 6, 2008, Pages 872-875

  Lucat, Claude ^a   Ginet, Patrick ^a   Castille, Christophe ^a   Debéda, Hélène ^a   Ménil, Francis ^a  

^a UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; COPPER; ELECTROSTATIC ACTUATORS; EMULSIFICATION; GAGES; HEATING; TECHNOLOGY; THICKNESS MEASUREMENT;

(E ,3E) PROCESS; (O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; ACTIVE LAYERS; ELECTRO THERMAL ACTUATORS; ELSEVIER (CO); LOW COSTS; MECHANICAL SUPPORTS; NEW PROCESSES; PASSIVE COMPONENTS; SACRIFICIAL LAYER PROCESS; SACRIFICIAL LAYERS; SCREEN-PRINTING;

HEAT TREATMENT;

EID: 45849116519     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.03.016     Document Type: Article

References (10)

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