Effects of process conditions on the synthesis and microstructure of nano-scale metal-containing amorphous carbon thin films

Journal of Nanoscience and Nanotechnology

Volumn 8, Issue 5, 2008, Pages 2623-2626

  Wu, Wan Yu ^a   Ting, Jyh Ming ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Metal containing amorphous carbon; Reactive sputter deposition; Self assembling

Indexed keywords

AMORPHOUS CARBON; CARBON FILMS; GASES; MAGNETRONS; METALS; NANOTECHNOLOGY; POLYMER FILMS; REACTIVE SPUTTERING; THIN FILMS;

ALTERNATING LAYERS; CONSTANT FLOW RATES; DC REACTIVE SPUTTER; DEPOSITION CHAMBERS; DEPOSITION CONDITIONS; DEPOSITION PARAMETERS; METAL CONTAINING AMORPHOUS CARBON; SELF-ASSEMBLING;

AMORPHOUS SILICON;

EID: 45849112917     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (12)

1. G. M. Whitesides and B. Grzybowski, Science 295, 2418 (2002).
2. R. Plass, J. A. Last, N. C. Bartelt, and G. L. Kellogg, Nature 412, 875 (2001).
3. W. Y. Wu and J. M. Ting, Carbon 44, 1210 (2006).
4. C. Ronning, I. Gerhards, M. Seibt, H. Hofsass, W. Y. Wu, and J. M. Ting, Nucl. Instrum. Methods Phys. Res. B, Beam Interact. Mater. Atoms 242, 261 (2006).
5. I. Gerhard, H. Stillrich, C. Ronning, and H. Hofsass, Phys. Rev. B 70, 245428 (2004).
6. C. Corbella, B. Echebarria, L. Ramirez-Piscina, E. Pascual, J. L. Andújar, and E. Bertran, Appl. Phys. Lett. 87, 213117 (2005).
7. W. Y. Wu and J. M. Ting, Chem. Phys. Lett. 388, 312 (2004).
8. B. N. Chapman, Glow Discharge Process, Wiley, New York (1980).
9. K. Bewilogua and H. Dimign, Surf. Coat. Technol. 61, 144 (1993).
10. J. Musil, P. Baroch, J. Vlcek, K. H. Nam, and J. G. Han, Thin Solid Films 475, 208 (2005).
11. M. P. Fitzner and J. R. Abelson, Mat. Res. Soc. Symp. Proc. 339, 435 (1994).
12. P. Eh. Hovsepian, Y. N. Kok, A. P. Ehiasarian, R. Haasch, J.-G. Wen. and I. Petrov, Surf. Coat. Technol. 200, 1572 (2005).