Variation of the morphology of electrodeposited copper thiocyanate films

Thin Solid Films

Volumn 516, Issue 20, 2008, Pages 7120-7124

  Selk, Yvonne ^a   Yoshida, Tsukasa ^b   Oekermann, Torsten ^a  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b GIFU UNIVERSITY   (Japan)

Author keywords

CuSCN; Dye sensitized p n solar cell; Electrochemical deposition; Structure directing agents

Indexed keywords

COPPER ALLOYS; COPPER PLATING; DIRECT ENERGY CONVERSION; DOPING (ADDITIVES); ELECTRODEPOSITION; ETHANOL; METALLIZING; MORPHOLOGY; NEGATIVE IONS; ORGANIC SOLVENTS; POSITIVE IONS; REDUCTION; SOLAR ENERGY; SURFACE ACTIVE AGENTS;

CATHODIC ELECTRODEPOSITION; COPPER (II); CU(1 1 0); DEPOSITION BATH; DEPOSITION CONDITIONS; DEPOSITION POTENTIALS; DYE MOLECULES; DYE-SENSITIZED; ELECTRODEPOSITED COPPER; FILM STRUCTURES; GRAIN SIZES;

COPPER;

EID: 45849099476     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.12.029     Document Type: Article

References (14)

1. O'Reagan B., and Grätzel M. Nature 353 (1991) 737
2. Shirakawa H., Louis E.J., MacDiarmid A.G., Chiang C.K., and Heeger A.J. J. Chem. Soc., Chem. Commun. 16 (1977) 578
3. Kubo W., Murakoshi K., Kitamura T., Yoshida S., Haruki M., Hanabusa K., Shirai H., Wada Y., and Yanagida S. J. Phys. Chem., B 105 (2001) 12809
4. Bach U., Lupo D., Comte P., Moser J.E., Weissortel F., Salbeck J., Spreitzer H., and Grätzel M. Nature 395 (1998) 583
5. Tennakone K., Kumara G.R.R.A., and Kumarasinghe A.R. Semicond. Sci. Technol. 10 (1995) 1689
6. Perera V.P.S., and Tennakone K. Sol. Energy Mater. Sol. Cells 79 (2003) 249
7. Larramona G., Chone C., Jacob A., Sakakura D., Delatouche B., Pere D., Cieren X., Nagino M., and Bayon R. Chem. Mater. 18 (2006) 1688
8. Izaki M., and Omi T. Appl. Phys. Lett. 68 (1996) 2439
9. Yoshida T., Pauporte T., Lincot D., Oekermann T., and Minoura H. J. Electrochem. Soc. 150 (2003) C608
10. Yoshida T., Iwaya M., Ando H., Oekermann T., Nonomura K., Schlettwein D., Wöhrle D., and Minoura H. Chem. Commun. (2004) 400
11. Oekermann T., Yoshida T., Minoura H., Wijayantha K.G.U., and Peter L.M. J. Phys. Chem., B 108 (2004) 8367
12. Yang B., Huijun L., Blackford M., and Luca V. Curr. Appl. Phys. 6 (2006) 436
13. Reference pattern database (ICDD PDF-2), PDF-number [29-581].
14. Yoshida T., Tochimoto M., Schlettwein D., Wöhrle D., Sugiura T., and Minoura H. Chem. Mater. 11 (1999) 2657