Pulsed electrodeposition of high aspect-ratio NiFe assemblies and its influence on spatial alloy composition

Microsystem Technologies

Volumn 14, Issue 8, 2008, Pages 1111-1115

  Giro, F ^a   Bedner, K ^a   Dhum, C ^a   Hoffmann, J E ^a   Heussler, S P ^c   Jian, L ^c   Kirsch, U ^b   Moser, H O ^c   Saumer, M ^a  

^a UNIVERSITY OF APPLIED SCIENCES KAISERSLAUTERN   (Germany)

^b Micromotion GmbH   (Germany)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ALLOYS; ASPECT RATIO; COPPER PLATING; DIMENSIONAL STABILITY; ELECTRODEPOSITION; ELECTRON MICROSCOPES; ELECTRON MICROSCOPY; ELECTRON OPTICS; ELECTROPLATING; GEARS; IMAGING TECHNIQUES; IRON; IRON PLATING; METALLIZING; MICROSCOPIC EXAMINATION; NICKEL; NICKEL ALLOYS; NICKEL PLATING; PLATING; REDUCTION; SCANNING; SCANNING ELECTRON MICROSCOPY; WHEELS;

(2+1) DIMENSIONS; ALLOY COMPOSITIONS; CROSS SECTIONING; DIRECT CURRENT (DC) PLATING; GEAR-WHEELS; HIGH ASPECT RATIO (HAR); IRON CONTENTS; LOCAL VARIATIONS; NICKEL-IRON ALLOYS; PULSE REVERSE CURRENT; PULSE REVERSE PLATING (PRP); PULSED ELECTRO-DEPOSITION (PED); SPRINGER (CO); SULPHATE BATH;

STRUCTURE (COMPOSITION);

EID: 45849096453     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0614-3     Document Type: Article

References (11)

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