Die casting mold design of the thin-walled aluminum case by computational solidification simulation

Journal of Materials Science and Technology

Volumn 24, Issue 3, 2008, Pages 383-388

  Kim, Young Chan ^a   Kang, Chang Seog ^a   Cho, Jae Ik ^a   Jeong, Chang Yeol ^a   Choi, Se Weon ^a   Hong, Sung Kil ^b  

^a Korea Institute of Industrial Technology   (South Korea)

^b Chonnam National University   (South Korea)

Author keywords

Aluminum casting alloy; Solidification simulation; Thin wall die casting

Indexed keywords

ALUMINUM COPPER ALLOYS; COMPUTER SIMULATION; DEFECTS; MOLDS; SILICON; SOLIDIFICATION; THIN WALLED STRUCTURES;

ALUMINUM CASTING ALLOY; ELECTRIC/ELECTRONIC HOUSINGS; LIGHTWEIGHT ALLOYS; SOLIDIFICATION SIMULATION; THIN WALL DIE CASTING;

DIE CASTING;

EID: 45549091191     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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