Corrosion behavior of copper with minor alloying addition in chloride solution

Journal of Alloys and Compounds

Volumn 462, Issue 1-2, 2008, Pages 240-243

  Zhang, Y N ^a   Zi, J L ^a   Zheng, M S ^b   Zhu, J W ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b NORTHWEST UNIVERSITY   (China)

Author keywords

Corrosion; Cyclic voltammetry; Metal; Potentiodynamic polarization

Indexed keywords

ADDITION REACTIONS; BINARY ALLOYS; BIOELECTRIC PHENOMENA; CHEMICAL ENGINEERING; CHEMICAL MODIFICATION; CHROMIUM; COPPER; COPPER ALLOYS; COPPER SMELTING; CORROSION; CYCLIC VOLTAMMETRY; HEALTH; METALS; MICROFLUIDICS; ORES; PAINTING; SOLUTIONS; VOLTAMMETRY; ZINC PLATING; ZIRCONIUM;

(O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; BINARY ADDITIONS; CHLORIDE SOLUTIONS; COPPER BASE ALLOYS; CORROSION BEHAVIORS; ELECTROCHEMICAL (EC) MEASUREMENTS; MINOR ALLOYING; NACL SOLUTIONS; PURE COPPER; SIGNIFICANT REDUCTION;

CORROSION RESISTANCE;

EID: 45449104043     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.08.008     Document Type: Article

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