High-frequency electromagnetic bandgap structures via indirect solid freeform fabrication

Journal of the American Ceramic Society

Volumn 87, Issue 8, 2004, Pages 1446-1453

  Reilly, Christopher J ^a   Chappell, William J ^a   Halloran, John W ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BANDPASS FILTERS; CURING; ELECTROMAGNETIC WAVE PROPAGATION; EQUIVALENT CIRCUITS; INSERTION LOSSES; LAYERED MANUFACTURING; MOLDS; RESONATORS; RHEOLOGY;

BINDER BURNOUT; DIELECTRIC FILTERS; DIELECTRIC RESONATORS; ELECTROMAGNETIC BANDGAP STRUCTURE; INDIRECT SOLID FREE FORM FABRICATION; MICROWAVE RANGE; MOLD FABRICATION; PERIODIC DIELECTRIC STRUCTURES;

DIELECTRIC MATERIALS;

EID: 4544373180     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2004.01446.x     Document Type: Article

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