Finite element study of three-dimensional flow and heat transfer in mold filling process

Computational Studies

Volumn 4, Issue , 2002, Pages 75-82

  Park, Jong Sun ^a   Kim, Min Soo ^b   Hur, Hoon ^c   Lee, Joon Sik ^a   Lee II, Woo ^a  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

^c Samsung Corning Co Ltd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; FINITE ELEMENT METHOD; LAMINAR FLOW; MATRIX ALGEBRA; NEWTONIAN FLOW; PROBLEM SOLVING; VECTORS;

MASS LUMPING METHOD; MOLD FILLING; PRESSURE GRADIENTS; VOLUME OF FLUID (VOF);

HEAT TRANSFER;

EID: 4544353667     PISSN: 14626063     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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