FEM modeling of temperature distribution of a flip-chip no-flow underfill package during solder reflow process

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 1, 2004, Pages 86-93

  Zhang, Zhuqing ^a   Sitaraman, Suresh K ^b   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; REACTION KINETICS; SOLDERING; TEMPERATURE DISTRIBUTION;

CURING KINETICS; FINITE ELEMENT MODELING; FLIP CHIP NO FLOW UNDERFILL PACKAGE; NO FLOW UNDERFILL; SOLDER REFLOW PROCESS;

ELECTRONICS PACKAGING;

EID: 4544347760     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.830505     Document Type: Article

References (20)

1. Y. Tsukada, "Surface laminar circuit and flip-chip attach packaging," in Proc. 42nd Electronic Components and Technology Conf., 1992, pp. 22-22.
2. R. Pennisi and M. Papageorge, "Adhesive and encapsulant material with fluxing properties," U.S. Patent 5 128746, 1992.
3. C. P. Wong and S. H. Shi, "No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant," U.S. Patent 6 180696, 2001.
4. D. Gamota and C. M. Melton, "The development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 20, pp. 183-183, 1997.
5. C. P. Wong, S. H. Shi, and G. Jefferson, "High performance no-flow underfills for flip-chip applications: Material characterization," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 450-450, 1998.
6. Z. Zhang and C. P. Wong, "Study and modeling of the curing behavior of no-flow underfill," in Conf. Proc. 8th Int. Symp. Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 2002, pp. 194-200.
7. J. M. Hurley, T Berfield, S. Ye, R. W. Johnson, R. Zhao, and G. Tian, "Kinetic modeling of no-flow underfill cure and its relationship to solder wetting and voiding," in Proc. 52nd IEEE Electronic Components and Technology Conf. 2002, 2002, pp. 828-833.
8. P. Morganelli and B. Wheelock, "Viscosity of a no-flow underfill during reflow and its relationship to solder wetting," in Proc. 51st Electronic Components and Technology Conf., 2001, pp. 163-166.
9. R. C. Dunne and S. K. Sitaraman, "An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach," IEEE Trans. Electron. Packag. Manufact., vol. 25, pp. 326-334, 2002.
10. D. G. Yang, G. Q. Zhang, L. J. Ernst, J. F. J. Caers, H. J. L. Bressers, and J. Janssen, "Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties," in Proc. 51st Electronic Components and Technologies Conf., Orlando, FL, 2001, pp. 919-924.
11. D. G. Yang, G. Q. Zhang, W. van driel, J. Hanssen, H. J. L. Bressers, and L. J. Ernst, "Parameter sensitive study of cure-dependent underfill properties on flip chip fallures," in Proc. 52nd Electronic Components and Technologies Conf., San Diego, CA, 2002, pp. 865-872.
12. A. D. Kraus and A. Bar-Cohen, Thermal Analysis and Control of Electronic Equipment. Bristol, PA: Hemisphere, 1983.
13. C. L. Yaws, Handbook of Thermal Conductivity. Houston, TX: Gulf, 1995, vol. 4.
14. CRC Handbook of Thermophysical and Thermochemical Data, 80th ed., D. R. Lide, Ed., CRC, Boca Raton, FL, 1999.
15. Y. S. Touloukian et al., Thermophysical Properties of Matter, Vol. 1, Thermal Conductivity: Metallic Elements and Alloy. West Lafayette, IN: Purdue Univ., Thermophysical Properties Research Center, 1970.
16. [Online]. Available: http://www.efunda.com
17. G. Lubin, Handbook of Composites. New York: Van Nostrand Reinhold, 1982.
18. R. R. Tummala, Ed., Fundamentals of Microsystems Packaging: Ch6. Fundamentals of Thermal Management. New York: McGraw-Hill, 2001.
19. H. Wolf, Heat Transfer. NewYork: Harper Row, 1983.
20. Z. Zhang and C. P. Wong, "Modeling of the curing kinetics of no-flow underfill in flip-chip applications," IEEE Trans. Comp. Packag. Technol., vol. 27, pp. 383-390, June 2004.