Device challenges and opportunities

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 2004, Pages 4-5

  Hu, Chenming ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER MOBILITY; COSTS; DIELECTRIC MATERIALS; LEAKAGE CURRENTS; OPTICAL INTERCONNECTS; STRESSES; THIN FILMS; TRANSPORT PROPERTIES;

GATE DIELECTRICS; HIGH MOBILITY MATERIALS; SLICIDATION; TRENCH ISOLATION;

CMOS INTEGRATED CIRCUITS;

EID: 4544324636     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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8. T. Park et al., IEDM Tech. Dig., p. 27, 2003
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10. K. Gopalakrishnan et al., IEDM Tech. Dig., p. 289, 2002
11. K. Keuzer, Univ. of California, Berkeley
12. B. Lin, SPIE Proceedings vol. 5377, 2004