Sidewall roughness measurement: A comparison of in- and off-line AFM techniques

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2004, Pages 221-226

  Guerry, Angela ^a   Gondran, Carolyn F H ^a   Miller, Kirk ^b  

^a SEMATECH   (United States)

^b VEECO INSTRUMENTS INC   (United States)

Author keywords

Atomic Force Microscopy (AFM); CD mode; In Line Metrology; Sidewall Roughness

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPUTER SOFTWARE; CORRELATION METHODS; ETCHING; IMAGE ANALYSIS; ROUGHNESS MEASUREMENT; SILICON;

CRITICAL DIMENSION (CD) MODE; IN-LINE METROLOGY; SIDEWALL ROUGHNESS (SWR);

SEMICONDUCTOR DEVICE TESTING;

EID: 4544306614     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Y. Martin, K. Wickramainghe, "Method for imaging sidewalls by atomic force microscopy," Appl. Phys. Lett. 64, 2498 (1994)
2. A. Ali, et al., "Nondestructive via in-hole profile characterization using atomic force microscopy metrology," J. Vac. Sci. Technol. B 20(1), Jan/Feb (2002)
3. K. Miller, et al, "Tip Characterization for CD-AFM: Getting 2 nm, 3 sigma,: SPIE Microlithography, 4689-102 (2002)