-
1
-
-
0036590719
-
The toughest transistor yet
-
May
-
L.F. Eastman and U. K. Mishra, "The Toughest Transistor Yet," IEEE Spectrum, May 2002, pp. 28-33.
-
(2002)
IEEE Spectrum
, pp. 28-33
-
-
Eastman, L.F.1
Mishra, U.K.2
-
2
-
-
0034155993
-
Transistors for microwave power amplifiers
-
March
-
R.J. Trew, "Transistors for Microwave Power Amplifiers," IEEE Microwave Magazine, 1, March 2000, pp. 46-54.
-
(2000)
IEEE Microwave Magazine
, vol.1
, pp. 46-54
-
-
Trew, R.J.1
-
3
-
-
12244255073
-
Transient characteristics of GaN-based heterostructure field-effect transistors
-
Feb.
-
E. Kohn, I. Daumiller, M. Kunze, M. Neuburger, M. Seyboth, T. Jenkins, J. Sewell, J. Van Norstrand, Y. Smorchkova, and U. Mishra, "Transient Characteristics of GaN-Based Heterostructure Field-Effect Transistors," IEEE Trans. Microwave Theory Tech., vol. MTT-51, pp. 634-642, Feb. 2003.
-
(2003)
IEEE Trans. Microwave Theory Tech.
, vol.MTT-51
, pp. 634-642
-
-
Kohn, E.1
Daumiller, I.2
Kunze, M.3
Neuburger, M.4
Seyboth, M.5
Jenkins, T.6
Sewell, J.7
Van Norstrand, J.8
Smorchkova, Y.9
Mishra, U.10
-
5
-
-
0030397256
-
A closed form solution of junction to substrate thermal resistance in semiconductor chips
-
Dec
-
F. Masatia, "A Closed Form Solution of Junction to Substrate Thermal Resistance in Semiconductor Chips," IEEE Trans. Components, Packaging, and Manufacturing Tech.-Part A 19, Dec. 1996, pp. 539-545.
-
(1996)
IEEE Trans. Components, Packaging, and Manufacturing Tech.-Part A
, vol.19
, pp. 539-545
-
-
Masatia, F.1
-
6
-
-
0034291496
-
Thermal analysis of solid-state devices and circuits: An analytical approach
-
N. Rinaldi, "Thermal analysis of solid-state devices and circuits: an analytical approach," Solid-State Electronics, 44, 2000, pp. 1789-1798.
-
(2000)
Solid-state Electronics
, vol.44
, pp. 1789-1798
-
-
Rinaldi, N.1
-
7
-
-
0035247201
-
Electrothermal model of GaAs FET devices for fast PC implementation
-
Feb. 2001
-
M. Pesare, A. Giorgio and A. Peril, "Electrothermal model of GaAs FET devices for fast PC implementation," IEE Proc.-Circuits Devices Systems, 148. Feb. 2001, pp. 40-44.
-
IEE Proc.-circuits Devices Systems
, vol.148
, pp. 40-44
-
-
Pesare, M.1
Giorgio, A.2
Peril, A.3
-
8
-
-
84988928901
-
Thermal models tor semiconductor device simulation
-
July 7
-
V. Palankovski and S. Silberherr, "Thermal Models tor Semiconductor Device Simulation," The Third European Conference on High Temperature Electronics, HITEN 99," July 7, 1999, pp. 25-28.
-
(1999)
The Third European Conference on High Temperature Electronics, HITEN 99,"
, pp. 25-28
-
-
Palankovski, V.1
Silberherr, S.2
-
9
-
-
0037954432
-
An assessment of wide bandgap semiconductors for power devices
-
May
-
J.L. Hudgins, G.S. Simin, E. Santi, and M. Asif Khan, "An Assessment of Wide Bandgap Semiconductors for Power Devices," IEEE Transactions on Power Electronics, vol. 18, May 2003, pp. 907-914.
-
(2003)
IEEE Transactions on Power Electronics
, vol.18
, pp. 907-914
-
-
Hudgins, J.L.1
Simin, G.S.2
Santi, E.3
Khan, M.A.4
-
10
-
-
0034317665
-
Self-heating effects in silicon carbide MESFETs
-
November
-
A.S. Royet, T. Ouisse, B. Cabon, O. Noblanc, C. Amodo, and C. Brylinski "Self-Heating Effects in Silicon Carbide MESFETs," IEEE Transaction on Electron Devices, vol. 47, November 2000, pp. 2221-2227.
-
(2000)
IEEE Transaction on Electron Devices
, vol.47
, pp. 2221-2227
-
-
Royet, A.S.1
Ouisse, T.2
Cabon, B.3
Noblanc, O.4
Amodo, C.5
Brylinski, C.6
-
11
-
-
0022664976
-
Raman microprobe study on temperature distribution during CW laser heating of silicon on sapphire
-
Feb.
-
M. Yamada, K. Nambu, Y. Itoh, and K. Yamamoto, "Raman microprobe study on temperature distribution during CW laser heating of silicon on sapphire," J. Appl. Phys. 59, Feb. 1986, pp. 1350-1354.
-
(1986)
J. Appl. Phys.
, vol.59
, pp. 1350-1354
-
-
Yamada, M.1
Nambu, K.2
Itoh, Y.3
Yamamoto, K.4
-
12
-
-
0035368035
-
A new approach to the dynamic thermal modeling of semiconductor packages
-
F.N. Masana, "A new approach to the dynamic thermal modeling of semiconductor packages," Microelectronics Reliability, 41, 2001, pp. 901-912.
-
(2001)
Microelectronics Reliability
, vol.41
, pp. 901-912
-
-
Masana, F.N.1
-
13
-
-
0022758356
-
Precise technique finds FET thermal Resistance
-
Aug.
-
H.F. Cooke, "Precise technique finds FET thermal Resistance," Microwaves & RF, Aug. 1986, pp. 85-87.
-
(1986)
Microwaves & RF
, pp. 85-87
-
-
Cooke, H.F.1
-
14
-
-
0029345471
-
On the application of the Kirchhoff transformation to the steady-state thermal analysis of semiconductor devices with temperature-dependent and piecewise inhomogeneous thermal conductivity,"
-
F. Bonani and G. Ghione, "On the application of the Kirchhoff transformation to the steady-state thermal analysis of semiconductor devices with temperature-dependent and piecewise inhomogeneous thermal conductivity," Solid-State Electronics, 38, no. 7, 1995, pp. 1409-1412.
-
(1995)
Solid-state Electronics
, vol.38
, Issue.7
, pp. 1409-1412
-
-
Bonani, F.1
Ghione, G.2
-
15
-
-
0036160966
-
Measurement of temperature in active high-power AlGaN/GaN HFETs using raman spectroscopy
-
Jan.
-
M. Kuball, et al., "Measurement of Temperature in Active High-Power AlGaN/GaN HFETs Using Raman Spectroscopy," IEEE Electron Device Letters, vol. 23, Jan. 2002, pp. 7-9.
-
(2002)
IEEE Electron Device Letters
, vol.23
, pp. 7-9
-
-
Kuball, M.1
-
16
-
-
0037421410
-
Measurement of temperature distribution in multlfinger AlGaN/GaN heterostructure field-effect transistors using microRaman spectroscopy
-
Jan.
-
M. Kuball, S. Rajasingam, A. Sarua, M. Uren, T. Martin, B. Hughes, K. Hilton, and R. Balmer, "Measurement of temperature distribution in multlfinger AlGaN/GaN heterostructure field-effect transistors using microRaman spectroscopy," Applied Physics Letters, 82, Jan. 2003, pp. 124-126.
-
(2003)
Applied Physics Letters
, vol.82
, pp. 124-126
-
-
Kuball, M.1
Rajasingam, S.2
Sarua, A.3
Uren, M.4
Martin, T.5
Hughes, B.6
Hilton, K.7
Balmer, R.8
-
17
-
-
0041385878
-
Thermal modeling and measurement of GaN-based HFET devices
-
July
-
J. Park, M.W. Shin, and C.C. Lee, "Thermal Modeling and Measurement of GaN-Based HFET Devices," IEEE Electron Device Letters, vol. 24, July 2003, pp. 424-426.
-
(2003)
IEEE Electron Device Letters
, vol.24
, pp. 424-426
-
-
Park, J.1
Shin, M.W.2
Lee, C.C.3
|