A kinetic model for iron aluminide coatings by low-pressure chemical vapor deposition: Part I. Deposition kinetics

Thin Solid Films

Volumn 466, Issue 1-2, 2004, Pages 339-346

  John, J T ^a   Srinivasa, R S ^b   De, P K ^a  

^a BHABHA ATOMIC RESEARCH CENTRE   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY BOMBAY   (India)

Author keywords

Aluminizing; Chemical vapor deposition; Coatings; Diffusion

Indexed keywords

ACTIVATION ENERGY; CHEMICAL VAPOR DEPOSITION; DIFFUSION; FLUIDIZED BED PROCESS; HIGH TEMPERATURE EFFECTS; PARTIAL PRESSURE; PRESSURE EFFECTS; PROTECTIVE COATINGS; REACTION KINETICS; SURFACE STRUCTURE;

ALUMINIZING; FLUIDIZED BED CHEMICAL VAPOR DEPOSITION (FECVD); PACK CEMENTATION; PURE COATINGS;

IRON COMPOUNDS;

EID: 4544280179     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.02.042     Document Type: Article

References (27)

1. Wood J.H., Goldman E.H. Sims C.T., Stoloff N.S., Hagel W.C. Superalloys II. 1987;359-384 Wiley, New York.
2. Goward G. Surf. Coat. Technol. 108-109:1998;73.
3. Bayer G.T. Mater. Perform. 34:1995;34.
4. Perez F.J., Pedraza F., Hierro M.P., Hou P.Y. Surf. Coat. Technol. 133-134:2000;338.
5. Voudouris N., Christoglou Ch., Angelopoulos G.N. Surf. Coat. Technol. 141:2001;275.
6. Smith A.B., Kempster A., Smith J. Surf. Coat. Technol. 120-121:1999;112.
7. Punola D., Sikkenga D., Sutton M. Adv. Mater. Process. 148(6):1995;29.
8. Warnes B.M., Punola D.C. Surf. Coat. Technol. 94-95:1997;1.
9. J. T. John, PhD thesis, Indian Institute of Technology, Bombay, 2001.
10. Nciri B., Vandenbulke L. Thin Solid Films. 139:1986;311.
11. Bangaru N.V., Krutenat R.C. J. Vac. Sci. Technol. B2(4):1984;806.
12. Pint B.A., Zhang Y., Tortorelli P.F., Haynes J.A., Wright I.G. Mater. High Temp. 18(3):2001;185.
13. Sivakumar R., Janardhana Rao E. Oxid. Met. 17:1982;391.
14. Sun W.P., Lin H.J., Hon M.H. Thin Solid Films. 146:1987;55.
15. Hickl J., Heckel R.W. Metall. Trans., A, Phys. Metall. Mater. Sci. 6A:1975;431.
16. Green S.W., Stott F.H. Oxid. Met. 36:1991;239.
17. Denner S.G., Jones R.D. Met. Technol. (Lond.). 4(3):1977;167.
18. El Mahallaway N.A., Taha M.A., Shady M.A., El-Sissi A.R., Attia A.N., Reif W. Mater. Sci. Technol. 13:1997;832.
19. Bahadur A. Mater. Manuf. Process. 11:1996;225.
20. Hirai S., Katayama H.G., Sasaki K., Kanisava H. Nippon Kinzoku Gakkaishi. 59:1995;284. (in Japanese) [Chem. Abs. - 122: 295 922 p].
21. Hirai S., Katayama H.G., Sasaki K., Kanisava H. Nippon Kinzoku Gakkaishi. 59:1995;284. (in Japanese) [Chem. Abs. - 122: 295 922 p].
22. Nishida K., Yamamoto T., Nagatha T. Trans. Jpn. Inst. Met. 12:1971;310.
23. Kale G.B., Patil R.V., Gawade P.S. J. Nucl. Mater. 257:1998;44.
24. Kwon S.C., Lee J.Y. Can. Metall. Q. 20:1981;351.
25. Singheiser L., Wahl G., Thiele W. Thin Solid Films. 107:1983;443.
26. Fitzer E., Maeurer H.J. Arch. Eisenhüttenwes. 49:1978;95. (in German) [Chem. Abs. No 89:63400].
27. Fitzer E., Maeurer H.J. Arch. Eisenhüttenwes. 49:1978;95. (in German) [Chem. Abs. No 89:63400].