Creep characterization of al alloy thin films for use in mems applications

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 272-278

  Modlinski, R ^a,b   Witvrouw, A ^a   Ratchev, P ^a   Puers, R ^b   Den Toonder, J M J ^c   De Wolf, I ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Al alloys; Creep; Dislocations; MEMS; Precipitates; RF MEMS switches

Indexed keywords

ALUMINUM ALLOYS; CREEP; DISLOCATIONS (CRYSTALS); SCANNING ELECTRON MICROSCOPY; STRESS RELAXATION; TENSILE STRESS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

CREEP SENSITIVE MATERIALS; ISOTHERMAL MEASUREMENTS; TENSILE STRESS RELAXATION;

MICROELECTROMECHANICAL DEVICES;

EID: 4544278573     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.045     Document Type: Conference Paper

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