"Extreme edge engineering" - 2mm edge exclusion challenges and cost-effectsve solutions for yield enhancement in high volume manufacturing for 200 and 300mm wafer fabs

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2004, Pages 453-460

  Tran, Thy ^a   Roberts, William ^a   Tiffany, Jason ^a   Jekauc, Igor ^a   Clements, Nicholas ^a   Jowett, Paul ^a   Ferguson, Reuben ^a   Mattson, Dan ^a   Demmert, Cort ^a   Richmond, Mark ^a   Wiendl, Christian ^a   Bruno, Michael ^a   Brock, Aaron ^a   Taylor, Thomas ^a  

^a INFINEON TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LITHOGRAPHY EDGE COATINGS; SCRIBE READABILITY; SHARED-DRIVER SHORTS; WAFER FABS;

CHEMICAL VAPOR DEPOSITION; COATINGS; COSTS; DEFORMATION; LITHOGRAPHY; MICROPROCESSOR CHIPS; PATTERN RECOGNITION; PLASMAS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 4544264885     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)