Physical characterisation of selective stress coupling for resonant pressure sensors

Sensors and Actuators, A: Physical

Volumn 115, Issue 2-3 SPEC. ISS., 2004, Pages 230-234

  Kinnell, P K ^a   Ward, M C L ^a   Carddock, R ^b  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

^b GE Druck Limited   (United Kingdom)

Author keywords

Packaging; Pressure; Resonant; Strain gauge; Stress isolation

Indexed keywords

ACTUATORS; FINITE ELEMENT METHOD; PACKAGING; PRESSURE EFFECTS; RESONANCE; RESONATORS; STRAIN GAGES; STRESS ANALYSIS;

RESONANT PRESSURE SENSORS; STRESS COUPLINGS; STRESS ISOLATION;

SENSORS;

EID: 4544263125     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.01.061     Document Type: Conference Paper

References (5)

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5. V.L. Spiering, S. Bouwstra, R.M.E.J. Spiering, M. Elwenspoek, On-chip decoupling zone for package-stress reduction, in: Digest of Technical Papers, TRANSDUCERS'91, 24-27 June 1991, pp. 982-985.