Kinetics of As, Sb, Bi and Pb volatilization from industrial copper matte during Ar + O2 bubbling

Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science

Volumn 35, Issue 4, 2004, Pages 651-661

  Sohn, H S ^a   Fukunaka, Y ^b   Oishi, T ^c   Asaki, Z ^e   Sohn, H Y ^d  

^a Kyungpook National University   (South Korea)

^b KYOTO UNIVERSITY   (Japan)

^c KANSAI UNIVERSITY   (Japan)

^d UNIVERSITY OF UTAH   (United States)

^e MITSUBISHI MATERIALS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY; ARGON; ARSENIC; BISMUTH; COMPOSITION; LEAD; OXIDATION; OXYGEN; REACTION KINETICS; SLAGS; VAPORIZATION;

BUBBLING; COPPER MATTE; ELIMINATION RATE;

COPPER;

EID: 4544257394     PISSN: 10735615     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11663-004-0006-8     Document Type: Article

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