Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement

Microelectronics Reliability

Volumn 42, Issue 9-11, 2002, Pages 1497-1500

  Roy, D ^a   Bruyere, S ^a   Vincent, E ^a   Monsieur, F ^a,b  

^a STMICROELECTRONICS   (France)

^b CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; RELIABILITY;

BREAKDOWN DETECTION; MODEL-BASED OPC; OXIDE BREAKDOWN; OXIDE THICKNESS; RELIABILITY PROJECTION; SERIES RESISTANCES; WEIBULL;

WEIBULL DISTRIBUTION;

EID: 4544255970     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00177-4     Document Type: Conference Paper

References (5)

1. E.Y.Wu et al. IEDM. 1999
2. B.E.Weiret al IEDM 1999
3. J.Sthatisand DiMana.IEDM 1998. p167
4. A.Bermann. IRPS 1981
5. E.Y Wu et al, IEEE Trans. Electron Devices, vol 1. 2001