Thermal diffusion and associated stress field due to high speed source

Journal of Aerospace Engineering

Volumn 15, Issue 3, 2002, Pages 118-124

  Baker, William P ^a   Palazotto, Anthony N ^a   Laird, David J ^a  

^a Air Force Institute of Technology   (United States)

Author keywords

Modals; Temperature; Thermal diffusion

Indexed keywords

HIGH SPEED COMPUTERS; HIGH SPEED SOURCES; HYPERSONIC REGIMES; STEADY-STATE SOLUTIONS;

COMPUTATIONAL METHODS; FAILURE ANALYSIS; MATHEMATICAL MODELS; SHOCK WAVES; STRESSES; THERMAL EFFECTS; TRANSPORT PROPERTIES;

THERMAL DIFFUSION;

EID: 4544245229     PISSN: 08931321     EISSN: None     Source Type: Journal    
DOI: 10.1061/(ASCE)0893-1321(2002)15:3(118)     Document Type: Article

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