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Volumn 270, Issue 3-4, 2004, Pages 316-321
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Reduction of tensile stress in GaN grown on Si(1 1 1) by inserting a low-temperature AlN interlayer
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Author keywords
A1. X ray diffraction; A3. Metalorganic chemical vapor deposition; B1. Nitride; B2. Semiconductor III V materials
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Indexed keywords
ALUMINUM NITRIDE;
ATOMIC FORCE MICROSCOPY;
DISLOCATIONS (CRYSTALS);
EPITAXIAL GROWTH;
LATTICE CONSTANTS;
METALLORGANIC CHEMICAL VAPOR DEPOSITION;
MICROCRACKS;
NUCLEATION;
SILICON;
TENSILE STRESS;
X RAY DIFFRACTION;
INTERLAYER;
NITRIDE;
ROOM TEMPERATURE;
SEMICONDUCTOR III-V MATERIALS;
GALLIUM NITRIDE;
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EID: 4544236355
PISSN: 00220248
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jcrysgro.2004.06.040 Document Type: Article |
Times cited : (47)
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References (16)
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