Thickness measurements of a TEM foil and its surface layer by electron energy-loss spectroscopy

Microscopy and Microanalysis

Volumn 10, Issue SUPPL. 2, 2004, Pages 882-883

  Jin, Qiang ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 4544235738     PISSN: 14319276     EISSN: None     Source Type: Journal    
DOI: 10.1017/s1431927604881327     Document Type: Conference Paper

References (6)

1. E. Van Cappellen, Microsc. Microanal. Microstruct. 1 (1990) 1.
2. Shixin Wang, submitted to MM 2004 meeting.
3. T. Malis, S.C. Cheng, and R.F. Egerton, J. Elec. Microsc. Tech. 8 (1988) 193.
4. D.B. Williams et al., Transmission Electron Microscopy, Plenum Press, New York, 1996.
5. R.E. Burge and D. L. Misell, Phil. Mag. 18 (1968) 251.
6. S.M. Allen, Phil. Mag. A43 (1981) 325.