Advanced STI patterning for 70nm DRAM technology and beyond

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2004, Pages 84-88

  Stavrev, Momtchil ^a   Scire, Alessia ^a   Vogt, Mirko ^a   Klingbeil, Patrick ^a   Liao, Chun Cheng ^a   Gruss, Stefan ^a   Froehlich, Hans Georg ^a   Mothes, Kerstin ^a   Bauch, Lothar ^a   Wege, Stephan ^a   Thyssen, Norbert ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Carbon; DRAM; Etch; Hard Mask; STI

Indexed keywords

ANTIREFLECTION COATINGS; ELECTRODES; ETCHING; LITHOGRAPHY; MASKS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

CARBON FILMS; DEEP TRENCH TOPOGRAPHY; IMPEDANCE MATCHING NETWORKS; SHALLOW TRENCH ISOLATION (STI);

DYNAMIC RANDOM ACCESS STORAGE;

EID: 4544228717     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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