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Volumn 130, Issue 2, 2008, Pages 0210111-0210119

Thermal stress analysis/life prediction of concentrating photovoltaic module

Author keywords

Concentrating photovoltaic cell (CPV); Fatigue test; Life prediction; Reliability; Thermal stress; Viscoplastic

Indexed keywords

(8 HYDROXY QUINOLINE) ALUMINUM; (ABIOTIC AND BIOTIC) STRESS; (I ,J) CONDITIONS; BONDING MATERIALS; CELL TEMPERATURES; FATIGUE TESTS; FINITE ELEMENT (FE); LEAD-FREE SOLDER (SN-3.5AG-0.5CU); MODULE CONFIGURATIONS; OPERATING CONDITIONS; PHOTOVOLTAIC (PV); PHOTOVOLTAIC MODULE (PVM); RESEARCH CENTERS; RESIDUAL STRESS ANALYSIS; ROUGH ESTIMATION; STEADY STATE OPERATIONS; STRENGTH (IGC: D5/D6); STRUCTURAL FAILURES; SYSTEM START-UP; TEMPERATURE PROFILING; UNITED TECHNOLOGIES (CO); VISCO-PLASTIC;

EID: 45249095589     PISSN: 01996231     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2840572     Document Type: Article
Times cited : (24)

References (11)
  • 9
    • 0022218769 scopus 로고
    • Constitutive Equations for Hot-Working of Metals
    • Anand, L., 1985, "Constitutive Equations for Hot-Working of Metals," Int. J. Plast., 1, pp. 213-231.
    • (1985) Int. J. Plast , vol.1 , pp. 213-231
    • Anand, L.1
  • 10
    • 0024858446 scopus 로고
    • An Internal Variable Constitutive Model for Hot Working of Metals
    • Brown, S. B., Kim, K. H., and Anand, L., 1989, "An Internal Variable Constitutive Model for Hot Working of Metals," Int. J. Plast, 5(2), pp. 95-130.
    • (1989) Int. J. Plast , vol.5 , Issue.2 , pp. 95-130
    • Brown, S.B.1    Kim, K.H.2    Anand, L.3
  • 11
    • 0029217431 scopus 로고
    • Optimizing the Reliability of Thin Small Outline Package (TSOP) Solder Joints
    • Advances in Electronic Packaging
    • Darveaux, R., 1995, "Optimizing the Reliability of Thin Small Outline Package (TSOP) Solder Joints," Advances in Electronic Packaging, Proc. ASME Interpack '95, pp. 675-685.
    • (1995) Proc. ASME Interpack '95 , pp. 675-685
    • Darveaux, R.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.